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2018 Florida Chapter Technical Workshop and Symposium - Design for DoD

Feb 21, 2018 1:00pm -
Feb 21, 2018 7:30pm

Event Description

IMAPS Florida Chapter

Technical Workshop and Symposium on

Advanced Manufacturing and Innovative Design

For DOD Systems

Digital Design, Multi - Materials, Processes & Applications


February 21, 2018

CAMID - Florida Institute of Technology (FIT)
Larsen Motorsports
Palm Bay, Fl. 32905

General Co-Chair
C. Mike Newton, President, Newton Cyberfacturing, Inc.
Dr. Daniel R. Kirk, Associate Dean for Research, Professor Aerospace Engineering, FIT


Technical Chair – James Zunino, US Army AMRDEC

Technical Committee
Dr. Amit Kumar (BRIDG), Tim Davis (JDM Associates), Dr. Kinzy Jones (Magic Leap), Tim Sparks (Sparks Electronics Consulting). Dr. Nathan Crane (Associate Professor, University of South Florida)


Student Outreach Co- Chair
Juan Avendano, Director of Student Projects College of Engineering and Computing, FIT
Dr. Tengfei Jiang, Assistant Professor, MSE University of Central Florida


For a Tabletop Exhibit Contact Timothy Davis:
tim@jdm-associates.com and Register Below

Workshop Focus:

The objective of the Advanced Manufacturing Workshop and Symposium is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of emerging electronic packaging technology. This workshop and tabletop exhibits enables discussion and presentations on the latest materials, process, hybrid & emerging advanced manufacturing, maker community and the future of integrated design tools, PLM, digital twin, AR/VR, cyber-based manufacturing and cybersecurity.


​Technical Keynote: 
Dr. Michael W. Grieves

Executive Director – Center for Advanced Manufacturing and Innovative Design

Bio: http://research3.fit.edu/camid/

Abstracts are being requested for the following areas:

·   3D, Additive/Subtractive Manufacturing

·   Digital Printing / Deposition Technologies

·   Nanomaterials, inks, epoxies & adhesives

·   Printed electronics

·   Thin & printable battery technology

·   Membrane and capacitive switches

·   Novel die interconnect

·   Metrology

·   Digital Design/Cyberfacturing/Cybersecurity

·   Augment & Virtual Simulation/Design

·   Paper based, PET & PVC substrate media

·   Printable display & lighting

·   Thin and ultra-miniature components

·   Dual Use and DoD Applications

·   Polymer Thick Film Materials

·   Advanced Ceramic materials/packaging

Symposium attendees are invited to attend the Maker Faire Palm Bay on February 24th Same Location


​Deadline: February 9, 2018

Click here to submit

Best Poster Awards: 1st $500 / 2nd $300 / 3rd $200

Event Type:Chapter
Category:Chapter Meeting
Early registration ends on Feb 09, 2018.
Regular registration starts on Feb 10, 2018 and ends on Feb 20, 2018.
Late registration starts on Feb 21, 2018.
(GMT-05:00) Eastern Time (US & Canada)


Registration Fees
Fee TypeEarlyRegularLate
 IMAPS Member
Member Fee: $25.00$35.00$35.00
Non-Member Fee: $30.00$40.00$40.00
Member Fee: $25.00$35.00$35.00
Non-Member Fee: $30.00$40.00$40.00
Member Fee: $25.00$35.00$35.00
Non-Member Fee: $25.00$35.00$35.00
Member Fee: $20.00$30.00$30.00
Non-Member Fee: $20.00$30.00$30.00
 Chapter Officer
Member Fee: $25.00$35.00$35.00
Non-Member Fee: $25.00$35.00$35.00
 Premier Sponsor (incl: poster/logo, 2 booth badges, ads...)
Member Fee: $150.00$150.00$150.00
Non-Member Fee: $150.00$150.00$150.00
 Tabletop Exhibit (incl: 1 tabletop, 1 booth badge)
Member Fee: $300.00$350.00$350.00
Non-Member Fee: $300.00$350.00$350.00
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