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2018 Florida Chapter Technical Workshop and Symposium - Design for DoD

Feb 21, 2018 1:00pm -
Feb 21, 2018 7:30pm
(GMT-5)

Event Description

IMAPS Florida Chapter

Technical Workshop and Symposium on

Advanced Manufacturing and Innovative Design

For DOD Systems

Digital Design, Multi - Materials, Processes & Applications

http://imaps.org/florida/

February 21, 2018

CAMID - Florida Institute of Technology (FIT)
​Venue: 
Larsen Motorsports
Palm Bay, Fl. 32905

General Co-Chair
C. Mike Newton, President, Newton Cyberfacturing, Inc.
Dr. Daniel R. Kirk, Associate Dean for Research, Professor Aerospace Engineering, FIT

 

Technical Chair – James Zunino, US Army AMRDEC
 

Technical Committee
Dr. Amit Kumar (BRIDG), Tim Davis (JDM Associates), Dr. Kinzy Jones (Magic Leap), Tim Sparks (Sparks Electronics Consulting). Dr. Nathan Crane (Associate Professor, University of South Florida)

 

Student Outreach Co- Chair
Juan Avendano, Director of Student Projects College of Engineering and Computing, FIT
Dr. Tengfei Jiang, Assistant Professor, MSE University of Central Florida

 

For a Tabletop Exhibit or Sponsorship Contact Timothy Davis:
tim@jdm-associates.com and Register Below

Workshop Focus:

The objective of the Advanced Manufacturing Workshop and Symposium is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of emerging electronic packaging technology. This workshop and tabletop exhibits enables discussion and presentations on the latest materials, process, hybrid & emerging advanced manufacturing, maker community and the future of integrated design tools, PLM, digital twin, AR/VR, cyber-based manufacturing and cybersecurity.

 

​Technical Keynote: 
Dr. Michael W. Grieves

Executive Director – Center for Advanced Manufacturing and Innovative Design

Bio: http://research3.fit.edu/camid/

 

Wednesday 21st

Registration starts at 7:00 am

SPACE COAST FABLAB

Continental Breakfast: 7:30 am – 8:30 am

Sponsored By

Exhibit Hours: 10:00 am – 4:00 pm Welcome: 8:00

General Co-Chairs

C. Mike Newton, Florida IMAPS Chapter President

Dr. Daniel R. Kirk, Professor in Mechanical and Aerospace Engineering and the Associate Dean for Research

Palm Bay Mayor Honorable William Capote

Morning Session: 8:30 am – 12:15 pm

Technical Chair - Mr. James L. Zunino III, U.S. Army

 

8:30 – 9:00          Mesoscale Ceramic Cylindrical Ion Trap Mass Analyzers for In situ Sample Analysis

Patrick Roman, Facilities Manager, Advanced Materials Engineering Institute (AMERI), Florida International University

 

9:00 – 9:30          Advanced Additive Manufacturing of RF/Microwave Electronics Based on Novel Nanocomposite Materials

Dr. Jing Wang, Associate Professor and Co-Director of Center for Wireless and Microwave Information Systems (WAMI), University of South Florida, Tampa, USA

 

9:30 – 10:00        Additively Manufactured mm-Wave Microelectronic Packaging

Dr. Eduardo A. Rojas Nastrucci, Assistant Professor

Wireless Devices and Electromagnetics Laboratory

Embry-Riddle Aeronautical University

 

Coffee Break- Larsen Motorsports

10:00 am - 10:30 am

Break Sponsored By TBD

 

10:30 – 11:00      Recent Advances in Embedded Power and RF Passive Components

Dr. PM Raj, Faculty at Florida International University,

And adjunct research faculty with the 3D Systems Packaging Research Center (PRC), Georgia Institute of Technology, Atlanta, USA

 

11:00 – 11:30      Development of Manufacturing Technologies To Enable Munition Designs

Daniel P. Schmidt, RDECOM ARDEC, US Army

 

Exhibitor Presentations 11:30 am – 12:00 pm

Buffet Lunch: 12:00 pm – 12:45 pm

 

12:15 Featured Speaker – Dr. Michael Grieves

Executive Director – Center for Advanced Manufacturing and Innovative Design

Florida Institute of Technology (CAMID)

 

Larsen Facilities Tour

12:45 – 1:30

 

Afternoon Session: 1:30 pm – 6:00 pm

 

 

1:30 – 2:00          Utilizing PCB Reverse Engineering to address the Diminishing Supply and Obsolescence of PCBs for Legacy Systems

William F. Loving, President & CEO, ScanCAD International, Inc.

 

2:00 – 2:30          Software and process development for hybrid additive manufacturing of circuits and electromagnetic devices

Ubaldo Robles, Research Associate, University of Texas El Paso

 

2:30 – 3:00          Applying Electronic Qualification Standards to 3D printed Structures with Embedded Electronics

Dr. Nathan Crane, Associate Professor, Mechanical Engineering, University of South Florida

 

Coffee Break: 3:00 pm – 3:30 pm

Break Sponsored By TBD

 

* University Student Poster Judging *

 

3:30 – 4:00          Advanced and Additive Manufacturing for Space Antennas

Dr. Robert Taylor, Adjacent Technology Lead, Space Antennas, Harris Corp.

 

4:00 – 4:30          Direct Digital Manufacturing for next generation electronic packaging

Dr. Kenneth H. Church, President/CEO, nScrypt, Inc.

 

4:30 – 5:00          Transforming Armaments Manufacturing Utilizing Additive Manufacturing and Printed Electronics

Mr. James L. Zunino III, RDECOM ARDEC, US Army

                                                 

5:00 – 5:30          Cybersecurity - Block Chain in the Supply Chain

Donald Beavers, President, Probability and Statistics, Inc.

 

5:30 Poster Winner Announcement and Closing Remarks

Technical Chair: Jim Zunino, US Army

 

6:00 Cheese and Wine Social

Sponsored by Probability and Statistics, Inc.

 

Technical Committee

Dr. Amit Kumar (BRIDG), Tim Davis (JDM Associates), Dr. Kinzy Jones (Magic Leap), Tim Sparks (Sparks Electronics Consulting).

Student Outreach Co- Chair

Juan Avendano, Director of Student Projects College of Engineering and Computing, FIT

Dr. Tengfei Jiang, Assistant Professor, MSE University of Central Florida

 

Palm Bay Maker Faire February 24th

http://palmbay.makerfaire.com/

*** CALL FOR STUDENT POSTERS ***

​Deadline: February 9, 2018

Click here to submit

Best Poster Awards: 1st $500 / 2nd $300 / 3rd $200


Event Type:Chapter
Category:Chapter Meeting
Early registration ends on Feb 09, 2018.
Regular registration starts on Feb 10, 2018 and ends on Feb 20, 2018.
Late registration starts on Feb 21, 2018.
(GMT-05:00) Eastern Time (US & Canada)

 

Registration Fees
Fee TypeEarlyRegularLate
 IMAPS Member
Member Fee: $25.00$35.00$35.00
Non-Member Fee: $30.00$40.00$40.00
 Non-Member
Member Fee: $25.00$35.00$35.00
Non-Member Fee: $30.00$40.00$40.00
 Speaker
Member Fee: $25.00$35.00$35.00
Non-Member Fee: $25.00$35.00$35.00
 Student
Member Fee: $20.00$30.00$30.00
Non-Member Fee: $20.00$30.00$30.00
 Chapter Officer
Member Fee: $25.00$35.00$35.00
Non-Member Fee: $25.00$35.00$35.00
 Premier Sponsor (incl: poster/logo, 2 booth badges, ads...)
Member Fee: $150.00$150.00$150.00
Non-Member Fee: $150.00$150.00$150.00
 Tabletop Exhibit (incl: 1 tabletop, 1 booth badge)
Member Fee: $300.00$350.00$350.00
Non-Member Fee: $300.00$350.00$350.00
 
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