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IMAPS 2019 - 52nd International Symposium on Microelectronics

Sep 30, 2019 07:00am -
Oct 03, 2019 01:00pm
(GMT-5)

Event Description

IMAPS 2019 - Boston
52nd Symposium on Microelectronics

 


www.imaps2019.org

Conference:
October 1-3, 2019
Exhibition:
October 1-2, 2019
Professional Development Courses:
September 30, 2019
General Chair:
Curtis Zwenger
Amkor Technology
General Chair-elect (2020):
Habib Hichri
SUSS Microtec
Past General Chair (2018):
Mark Gerber
ASE US Inc.

For Exhibitors
   


Phase I for Sponsors - Opens December 2018
Phase II for Returning IMAPS 2018 Exhibitors - Opens January 2019
Phase III Open to All/Public - April 2019

 


The 52nd International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2019 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions on:

TRACK 1:
SiP/SiM (System Solutions)
TRACK 2:
Wafer Level/Panel Level (Advanced RDL)
TRACK 3:
High Performance / High Reliability
TRACK 4:
Flip Chip/2.5D/3D/Optical (Advanced Package)
TRACK 5:
Additive Manufacturing & Enabling Technologies

PLANNED SESSIONS:

• System Design & Integration
• CPI & Modeling
• Embedded/High Voltage
• Optical/Automotive
• Wearable / IoT
• System Partitioning / EMI Shielding
• Computing & Networking

PLANNED SESSIONS:

• Wafer-Level Fan Out
• WLCSP
• Advanced Fan Out & Heterogeneous Integration
• Panel-Level Fan Out
• MEMS & Sensors
• Edge Protection
• Carrier Technologies
• Reliability & Test

 

PLANNED SESSIONS:

• High Reliability - Defense/Aero
• MM Wave / High-Speed Packaging
• RF/Wireless Components
• High Reliability in Bio/Medical
• High Reliability in Extreme Environments
 

PLANNED SESSIONS:

• Large Body / Small Body FC
• 2.5D Technologies
• Optical / Photonics
• BUMP & Interconnect
• 3D Technologies
• 5G Applications
• Heterogeneous Integration

PLANNED SESSIONS:

• Advanced Equipment for Additive Manufacturing
• Flexible Electronics
• Substrate Technology

• Polymer Materials & Processes
• Novel Materials & Processes
• Advanced Wirebond

TRACK 6:
INTERACTIVE POSTER SESSION - "Posters & Pizza Lunch"

 

Special Paper Recognition - Cash Awards Offered!

6 "Best of Track" Outstanding Papers - Six (6) $500 Cash Awards
Six "Best of Track" Winners will then be reviewed for...

1 Best Paper of the Symposium - One (1) additional $500 Cash Award for a "Best of Track" Winner


IMAPS Microelectronics Foundation Student Paper Awards
The Foundation is offering CASH AWARDS to the best papers submitted and presented by students at IMAPS Symposium.
 

 

 

 


Student Presenters:

The Microelectronics Foundation sponsors Student Paper Competitions and Awards in conjunction with IMAPS 2018. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these awards. The review committee will evaluate all student papers/posters and award the following at the 2019 Symposium:

  • Three (3) "Outstanding Student Paper" Awards - $500 Each Award
  • One (1) "Best Student Paper of Symposium" Award - $2000 Award
  • One (1) "Best Student Poster Presentation" Award - $250 Award

The selected student must attend the event to present his or her work and receive the award.

The Microelectronics Foundation

 

IMAPS 2019 Poster Session:
Interactive Poster Session Student papers will be considered for this interactive session. Students submitting abstracts for the poster session will be required to submit a full paper which will be PEER-REVIEWED and considered for paper and poster awards noted above. If you are interested in presenting in the interactive session at IMAPS Symposium, select the "Poster Session" option under the session field on the abstract submission form.

Monday, September 30: 2-hour formats, by theme/track
8:00 AM-10:00 AM | 10:30 AM - 12:30 PM | 1:00 PM - 3:00 PM | 3:30 PM - 5:30 PM
*Attendees can take ONE PDC during each timeslot*

 

Track A:
Wire Bonding & Flip Chip

Track B:
Failure Analysis & Thermal

Track C:
Packaging Integration & Design

Track D:
Heterogeneous Integration &
Fan Out

8:00 AM-10:00 AM

A1: Understanding the Wire Bonding Process - Lee Levine, Process Solutions Consulting, Inc.

B1: Introduction to Failure Analysis in Semiconductor Package Assembly - Tom Dory, Fujifilm Electronic Materials USA

C1: Passive Components and Integration for High-Bandwidth Computing and Communication - P M Raj, Florida International University/Georgia Tech PRC

D1: Fan-Out Wafer/Panel-Level Packaging - John Lau, ASM Pacific Technology

10:00 AM-10:30 AM

Coffee / Networking
Open to all PDC participants

10:30 AM - 12:30 PM

A2: Introduction to Solder Flip Chip with an Emphasis on Cu Pillar - Mark Gerber, ASE US, Inc.

B2: Thermal and Dynamic Stress Failures in Electronic and Photonic Packaging: Prediction and Prevention - Ephraim Suhir, Portland State University

C2: Achieving High Reliability for Lead-Free Solder Joints - Materials Consideration  - Ning-Cheng Lee, Indium Corporation

D2: Evolution to Advanced Fan Out - John Hunt, ASE US Inc

12:30 PM-1:00 PM

Lunch
Open ONLY to PDC participants taking morning AND afternoon courses

1:00 PM-3:00 PM

A3: Flip Chip Package Technology and Assembly Processes - Tom Dory, Fujifilm Electronic Materials USA

B3: Understanding Package Failure Mechanisms for Improved Reliability - Christo Bojkov, QORVO

C3: Fundamentals of 3D and 2.5D Packaging Integration – Urmi Ray

D3: Heterogeneous Integrations              - John Lau, ASM Pacific Technology

3:00 PM-3:30 PM

Coffee / Networking
Open to all PDC participants

3:30 PM-5:30 PM

A4: Understanding the Role of Intermetallic Formation in Gold and Copper Wire Bonding - Lee Levine, Process Solutions Consulting, Inc.

B4: Thermal Management using Thermal Interface - Rita Mohanty, Henkel Corporation

C4: 5G/mmWave Package Development Requirements and Solutions – Urmi Ray

D4: Introduction to System in Package (SiP) - The Heterogeneous Integration Driver - Mark Gerber, ASE US, Inc.

5:30 PM-7:00 PM

Welcome Reception
Open to all IMAPS 2019 participants

 

 

Speaker/Author Information:

 
  • "Call For Abstracts" Open: October 15, 2018
  • ~1,000-Word Abstract Deadline: JANUARY 31, 2019
  • Confirmation of Abstract Receipt: Auto-Email Upon Submission (check spam/junk folders if you do not receive the email immediately upon submission)
  • Speaker Notification - Abstract Acceptance: April 1, 2019
  • Manuscripts Due for Peer-Review: May 15, 2019
  • Peer review feedback to authors: July 1, 2019
  • Final/corrected Papers due: August 1, 2019
  • SPEAKERS MUST BE REGISTERED ON/BEFORE August 15, 2019, OR YOU WILL BE REMOVED FROM THE PROGRAM LISTING
  • Early Registration / Hotel Deadline: August 15, 2019
  • 2-3 Sentence BIO due NOT LATER THAN: September 15, 2019
  • Speaker/Chair Breakfast Meeting: Morning of your Session/Presentation (TBD)
  • Slides/Presentation Ready for Presentation: on/before September 30, 2019

Event Type:Symposium
Category:International Symposium
Early registration ends on Sep 01, 2019.
Regular registration starts on Sep 02, 2019 and ends on Sep 29, 2019.
Late registration starts on Sep 30, 2019.
(GMT-05:00) Eastern Time (US & Canada)

 

Registration Fees
Fee TypeEarlyRegularLate
 Life Member
Member Fee: $775.00$875.00$875.00
Non-Member Fee: $875.00$975.00$975.00
 Member
Member Fee: $800.00$1000.00$1000.00
Non-Member Fee: $900.00$1100.00$1100.00
 Non-Member
Member Fee: $800.00$1000.00$1000.00
Non-Member Fee: $900.00$1100.00$1100.00
 Speaker
Member Fee: $625.00$800.00$800.00
Non-Member Fee: $625.00$800.00$800.00
 Session Chair
Member Fee: $625.00$800.00$800.00
Non-Member Fee: $625.00$800.00$800.00
 Chapter Officer
Member Fee: $625.00$800.00$800.00
Non-Member Fee: $625.00$800.00$800.00
 Student
Member Fee: $50.00$100.00$100.00
Non-Member Fee: $75.00$150.00$150.00
 PDC ONLY (Not Attending Conference)
Member Fee: $0.00$0.00$0.00
Non-Member Fee: $0.00$0.00$0.00
 Golf ONLY (Not Attending Conference)
Member Fee: $0.00$0.00$0.00
Non-Member Fee: $0.00$0.00$0.00
 Exhibits Only (Lunch Included) 
Member Fee: $30.00$30.00$30.00
Non-Member Fee: $30.00$30.00$30.00
 Sponsor - Coffee Break (1)
Member Fee: $1500.00$1500.00$1500.00
Non-Member Fee: $1500.00$1500.00$1500.00
 
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