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HiTEC 2018- High Temperature Electronics Conference

May 08, 2018 8:00am -
May 10, 2018 5:00pm
(GMT-7)

Event Description

International Conference on
High Temperature Electronics
(HiTEC 2018)

May 8-10, 2018
Hotel Albuquerque
800 Rio Grande Blvd. NW
Albuquerque, New Mexico 87104 USA

Please join us in Albuquerque, New Mexico for HiTEC 2018. Companies wishing to sponsor this conference or exhibit, or individuals Interested in submitting an abstract or getting involved as a session chair, please contact Brian Schieman at bschieman@imaps.org for more information.

HiTEC 2018 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics Assembly and Packaging Society, HiTEC 2018 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

 

 

 


Event Type:Conference
Category:International Conference
Early registration ends on Apr 13, 2018.
Regular registration starts on Apr 14, 2018 and ends on May 06, 2018.
Late registration starts on May 07, 2018.
(GMT-07:00) Mountain Time (US & Canada)

 

Registration Fees
Fee TypeEarlyRegularLate
 Tabletop Exhibit Booth
Member Fee: $625.00$725.00$725.00
Non-Member Fee: $725.00$825.00$825.00
 Corporate Sponsor (Includes Tabletop)
Member Fee: $1500.00$1500.00$1500.00
Non-Member Fee: $1500.00$1500.00$1500.00
 Premier Sponsor (Includes Tabletop)
Member Fee: $3000.00$3000.00$3000.00
Non-Member Fee: $3000.00$3000.00$3000.00
 
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