Topical Workshop & Tabletop Exhibits on
Additive Manufacturing &
September 30, 2019
Hynes Convention Center | Boston, MA
Abstract Deadline: May 17, 2019
Professor, Electrical and Computer Engineering, University of Massachusetts Lowell
Director, Printed Electronics Research Collaborative (PERC)
Co-Director Raytheon-U Mass Lowell Research Institute (RURI)
Mary Herndon, Raytheon; Greg Fritz, Draper Labs.
The International Microelectronics Assembly and Packaging Society (IMAPS) will host a Topical Workshop on ADDITIVE MANUFACTURING and PRINTED ELECTRONICS on September 30, 2018. Printing technology is expected to enable the evolution of electronics from rigid boards to products that are flexible, conformal or wearable. The workshop will bring together experts to report on the progress and the challenges of this emerging field. This technology is expected to impact the options for integration of active and passive components and will exploit additive approaches to advance microelectronic packaging. Conference sessions will cover the development of printable electronic materials (inks), the options for manufacturing/printing and the applications of printed and flexible electronics.
Sessions for this 1-day Workshop are being planned and abstracts are being requested in the following areas:
Materials and Printing Processes
Printed Devices & Packaging
- Conductive inks
- Dielectric inks
- Functional Ink Development
- Printing Technologies
- Chip Integration
- Embedded electronics in 3D
- Printed transistors
- Additive Packaging
- Human and Structural Monitoring
- Printed Antennas and RF Devices
Those wishing to present at the workshop must submit a 500+ word abstract electronically no later than MAY 17, 2019, using the on-line submittal form at: www.imaps.org/abstracts.htm. Please contact Brian Schieman by email at email@example.com if you have questions. Full papers are not required. A post-conference download containing the presentation material as supplied by the presenter onsite will be distributed to all attendees. Speakers are required to pay a reduced registration fee.
The Additive Workshop will be co-located with IMAPS 2019 Boston – the 52nd International Symposium on Microelectronics (www.imaps2019.org).