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2018 Florida Chapter Advanced Workshop & Tabletops on SMART SENSORS

Aug 23, 2018 07:00am -
Aug 23, 2018 05:00pm
(GMT-5)

Event Description

Near Disney World

The International Microelectronics, Assembly and Packaging Society

Florida Chapter Presents

SMART SENSORS

Research, Manufacturing & IoT Applications

http://imaps.org/florida/


Co-Chairs: 
Dr. Amit Kumar, Associate Director, 
Research and Technology Services, BRIDG


Dr. Tengfei Jiang, Assistant Professor,
Materials Science and Engineering, University of Central Florida


August 23, 2018
BRIDG - 200 NeoCity Way, NeoCity, FL 34744

 

Abstract Deadline for Speakers and Student Posters: June 30, 2018
Submit abstracts here


Workshop Focus:
Over 50 billion devices will be connected to smart sensors. Demand for sensors is expected to reach 1 trillion. What do these sensors do? They count your steps. Measure your acceleration to calculate your ETA when using GPS. They even automatically adjust your camera lens around ambient light to help you snap that perfect picture. These are just a few of the ways sensors unite to deliver a constant stream of leading-edge experiences on your smart phone. Beyond phones, sensors are infiltrating cars, buildings, appliances, medical equipment, and wearable devices that track personal fitness and health conditions. This workshop will bring together the scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of smart sensors, systems and advanced packaging technology. This workshop and tabletop exhibits enables discussion and presentations on the latest semiconductor based design, process and materials for smart sensor and photonic technologies.

  • Silicon Sensors
  • Optical Sensors
  • Wide Band Gap Power Electronics
  • Nanotechnology
  • Optical Interconnect
  • Novel Die Interconnect
  • Through Silicon Vias
  • 2.5 and 3D Die Stacking & Interposers
  • Digital Printing / Deposition Technologies
  • Internet of Things
  • Advanced Ceramic materials/packaging
  • Thin and ultra-miniature components
  • Metrology
  • Thin and ultra-miniature components
  • Design, Simulation and Modeling
  • Smart Sensor Applications
  • Polymer Thick Film Materials
  • Cybersecurity

The sensor-driven economy is estimated at $19 trillion (more than the entire US GDP in 2014) and is predicted to grow to $32.5 trillion by 2025.


Event Type:Chapter
Category:Chapter Meeting
Early registration ends on Aug 01, 2018.
Regular registration starts on Aug 02, 2018 and ends on Aug 22, 2018.
Late registration starts on Aug 23, 2018.
(GMT-05:00) Eastern Time (US & Canada)

 

Registration Fees
Fee TypeEarlyRegularLate
 Attendee
Member Fee: $25.00$35.00$35.00
Non-Member Fee: $30.00$40.00$40.00
 Student
Member Fee: $20.00$30.00$30.00
Non-Member Fee: $20.00$30.00$30.00
 Tabletop Exhibit (6ft Table)
Member Fee: $300.00$350.00$350.00
Non-Member Fee: $300.00$350.00$350.00
 Premier Event Sponsor
Member Fee: $150.00$175.00$175.00
Non-Member Fee: $150.00$175.00$175.00
 
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