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Chicago/Milwaukee Chapter Technical Symposium on Material & Process Advancements

Aug 14, 2012 11:30am -
Aug 14, 2012 04:00pm
(GMT-5)

Event Description

  Chicago-Milwaukee Chapter

                                    Industry Lunch, Facility Tour, and Presentations

                       Material & Process Advancements

                                     Tuesday, August 14

Program

 

11:30    Registration and Networking

 

12:00    Lunch and Chapter Announcements

 

12:45     “Palladium Copper and Silver Alloy Bonding Wire.”

William Crockett, Business Development Manager at Tanaka Kikinzoku International (America)

 

1:15     “High Reliability GGI Flip Chip Interconnect for Small Die.”

Philip Couts, Sales and Marketing Manager at TDK Corporation of America

 

1:45     Break with refreshments

 

2:00    “Ceramics for Medical Applications.”

Arne Knudsen, General Manager of Business Development at Kyocera America, Inc.

 

2:30     “How Silver Powder Metallurgy Affects the Physical Properties of Low Temperature Firing Silver Conductors.”

Samson Shahbazi, Senior Research Scientist at Heraeus Materials Technology, LLC

 

3:00     “Magnetically Aligned Anisotropic Conductive Adhesives for Electronic Assembly Applications.”

                    Eric Hoppenjans, President of Indiana Microelectronics, LLC

 

3:30     Facility Tour of Trace Laboratories

                        Kevin Mehaffey, General Manager of Trace Laboratories

 

4:00     Conclusion

 

 

Logistics:

 

Trace Laboratories, Inc.
1150 West Euclid Avenue

Palatine, IL 60067

(847) 934-5300

For more company information, click here - www.tracelabs.com 

Map & Directions Click Here

 

Registration: IMAPS Members - $20, Non-members: - $25, Students with IDs & displaced members: - $5

 

On-line registration guarantees seating and lunch. Please register by COB on Friday, August 10th.

Participants may pay on-site by cash or check only.

 

For additional chapter information, please contact Ken Burke of GE Healthcare at 847-345-0224 or burke.engineering@comcast.net


Event Type:Chapter
Category:Chapter Meeting
Early registration ends on Jun 20, 2012.
Regular registration starts on Jun 21, 2012 and ends on Aug 11, 2012.
Late registration starts on Aug 12, 2012.
(GMT-05:00) Eastern Time (US & Canada)

 

Registration Fees
Fee TypeEarlyRegularLate
 Attendee
Member Fee: $20.00$20.00$20.00
Non-Member Fee: $25.00$25.00$25.00
 Student or Displaced
Member Fee: $5.00$5.00$5.00
Non-Member Fee: $5.00$5.00$5.00
 
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