Industry Lunch, Facility Tour, and Presentations
Material & Process Advancements
Tuesday, August 14
11:30 Registration and Networking
12:00 Lunch and Chapter Announcements
12:45 “Palladium Copper and Silver Alloy Bonding Wire.”
William Crockett, Business Development Manager at Tanaka Kikinzoku International (America)
1:15 “High Reliability GGI Flip Chip Interconnect for Small Die.”
Philip Couts, Sales and Marketing Manager at TDK Corporation of America
1:45 Break with refreshments
2:00 “Ceramics for Medical Applications.”
Arne Knudsen, General Manager of Business Development at Kyocera America, Inc.
2:30 “How Silver Powder Metallurgy Affects the Physical Properties of Low Temperature Firing Silver Conductors.”
Samson Shahbazi, Senior Research Scientist at Heraeus Materials Technology, LLC
3:00 “Magnetically Aligned Anisotropic Conductive Adhesives for Electronic Assembly Applications.”
Eric Hoppenjans, President of Indiana Microelectronics, LLC
3:30 Facility Tour of Trace Laboratories
Kevin Mehaffey, General Manager of Trace Laboratories
Trace Laboratories, Inc.
1150 West Euclid Avenue
Palatine, IL 60067
For more company information, click here - www.tracelabs.com
Map & Directions Click Here
Registration: IMAPS Members - $20, Non-members: - $25, Students with IDs & displaced members: - $5
On-line registration guarantees seating and lunch. Please register by COB on Friday, August 10th.
Participants may pay on-site by cash or check only.
For additional chapter information, please contact Ken Burke of GE Healthcare at 847-345-0224 or firstname.lastname@example.org