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Carolinas Chapter Luncheon June 30

Jun 30, 2017 12:00pm -
Jun 30, 2017 01:00pm
(GMT-5)

Event Description

IMAPS Carolinas Chapter

 

Chapter Luncheon Meeting

June 30, 2017
​12:00-1:00

The Frontier
800 Park Offices Drive
Research Triangle Park, NC
Join us in The Classroom

Please join us for lunch social, networking, and presentation from Sitaram Arkalgud 

 

CMOS Image Sensor Evolution Enabled by Direct Bond Technology

 

Sitaram Arkalgud

3D R&D

Xperi

5400 Glenwood Avenue, Suite G-05

Raleigh, NC 27612

 

 

CMOS image sensors (CIS) have experienced substantial growth over the last 20 years due to the ability of their fabrication technology to scale.  Although much of this growth has come from traditional node scaling, pixel sensitivity has required the implementation of a new volume manufacturable fabrication technology to support further image sensor scaling. These requirements have been met with a direct bond technology that has enabled multiple generations of 3D image sensor manufacturing and lucrative commercial success for its adopters.  The first generation used a low distortion insulating direct bond of a front side CMOS wafer to a silicon handle wafer.  This enabled backside illuminated pixels which improved light absorption and facilitated pixel scaling below 1.75um.  The second generation also used a low distortion insulating direct bond of a front side CMOS wafer to another CMOS wafer front side in addition to TSVs exterior to the pixel array to interconnect the stacked CMOS.  This stacking enabled a substantial improvement in die size, process and CMOS cost, and pixel heating by introducing a vertical scaling component.  The third generation replaced the low distortion insulating direct bond used in the first two generations with a low distortion hybrid direct bond enabling submicron scalable per pixel 3D electrical interconnections interior to the pixel array and the elimination of expensive TSVs.

 

This presentation will describe insulating and hybrid direct bond variants invented and developed at Ziptronix and now available from Invensas which have been registered and are known as ZiBond® and DBI®, respectively.  Realized CIS scaling and potential further improvements in CIS enabled by use of direct bond technology will also be discussed.

 

Member and non-member registration is $10 per person, inclusive of lunch.   


Event Type:Chapter
Category:Chapter Meeting
Early registration ends on Jun 20, 2017.
Regular registration starts on Jun 21, 2017 and ends on Jun 29, 2017.
Late registration starts on Jun 30, 2017.
(GMT-05:00) Eastern Time (US & Canada)

 

Registration Fees
Fee TypeEarlyRegularLate
 Attendee
Member Fee: $10.00$10.00$10.00
Non-Member Fee: $10.00$10.00$10.00
 
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