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The Nordic Conference on Microelectronics Packaging, NordPac 2018

Jun 12, 2018 12:00pm -
Jun 14, 2018 5:00pm
(GMT+2)

Event Description

The Nordic Conference on Microelectronics Packaging, NordPac 2018

will be held

12th – 14th June 2018 at VTT in Oulu, Finland

 

Jointly arranged by IMAPS Nordic and IEEE EPS Nordic

Call for abstracts

We are proud to announce that the 2018 NordPac conference will be held in Finland. The event brand NordPac was introduced in Gothenburg in 2017 as a collaboration between IMAPS Nordic and IEEE EPS Nordic. The conference will take place at VTT Technical Research Centre of Finland Ltd in Oulu. The IMAPS Nordic conference was here in 2014. 

Abstract Submission

You are welcome to submit an abstract and suggestion for a paper to the NordPac Conference 2018. The abstract must be non-commercial and submitted in electronic form in our new conference portal no later than March 20, 2018.

Please fill in all required fields in the portal and your abstract text. Images and pictures can be uploaded separately (on page 2) in docx of pdf formats.

In the portal you will be required to register before submission.

Speakers will be notified of paper acceptance by email by April 20.

Full Paper submission

Full paper submission will aslo be done via our conference portal.

All approved, reviewed, papers will be included in the conference proceedings and submitted for inclusion to IEEE Xplore Digital Library (www.ieeexplore.ieee.org) after the authors’ approval. The paper must be original and not previously published. Avoid inclusion of Commercial content.

The paper should be 4 - 10 pages. Please download either the MS Word Template (.doc file) or the Latex-template (.zip file).

For students we have the possibility to have papers classified as Reviewed and published in both IEEE Xplore and IMAPS North America IMAPSource, see http://ieeexplore.ieee.org/ and http://www.imapsource.org.

The deadline for the final paper is May 22, but if you want your paper to be reviewed deadline is May 1st. Late papers are not published.

 

VISA information

If you require a VISA to enter Finland, you may need an Invitation Letter. Please contact the organising commitee on Conference@nordpac.org to receive your letter. An invitation letter can only be issued to speakers.

As part of the annual IMAPS Nordic conference, PhD and Master Students are especially encouraged to submit an abstract. For this we have set up a Review process for those who need reviewed and published papers. This is a great opportunity to interact with the industrial and academic community at an international level (coming from inside and outside the Nordic countries).

Printed, flexible electronics

Medical electronics

Unique materials, PTF and ACF

OPTO-ELECTRICAL and LED

High temperature electronics, harsh environment

Sensor integration & applications

3D Advanced interconnect, advanced packaging

Wearable electronics

Ceramics: thick film, copper plated, DBC, LTCC

Reliability assessments, SPC and FMEA

 

 

 

EXHIBITION

We will have an industrial exhibition along with the technical sessions.  If you are interested, please contact: Dr. Daniel Nilsen Wright, at exhibition@nordpac.org.

 The for the registering of your exhibition will soon be open through our conference portal .

For the latest information about the conference and the exhibition send e-mail to info@nordpac.org or to the Exhibition Host at exhibition@nordpac.org.

           


Event Type:Chapter
Category:Chapter Conference
Early registration ends on May 19, 2018.
Regular registration starts on May 20, 2018 and ends on Jun 09, 2018.
Late registration starts on Jun 10, 2018.
(GMT+02:00) Helsinki, Kyiv, Riga, Sofia, Tallinn, Vilnius

 

 
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