While 2019 has been a tough year, the outlook for 2020 is brighter. 5G is driving advanced packaging developments in mobile handsets and infrastructure. There is increased demand for high performance computing and new forms of heterogeneous integration are emerging. While automotive sales dipped in 2019, electronic content in automotive applications is increasing dramatically.
While wire bond packages remain the highest unit volume, higher performance needs continue to drive the shift to flip chip. Many future applications will use some form of hybrid bonding. This presentation examines the trends and the impact on the advanced packaging market.
E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer. She is a member of SEMI and IMAPS. She received the IMAPS GBC Partnership award in 2012, the Daniel C. Hughes, Jr. Memorial Award in 2018, and the Sidney J. Stein International Award in 2019. She is an IMAPS Fellow. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.
Sponsors receive a 6' table, a brief introduction and 1 luncheon.
Hilton Phoenix Chandler
2929 West Frye Road · Chandler, AZ
Click here for directions.
Tuesday, December 10, 2019
11:30 AM Registration, networking and exhibits
12:00 - 1:00 PM Lunch and Presentation
1:30 Exhibits Close
The IMAPS AZ Chapter strives to bring interesting speakers and topics to our community. If you, or someone you know, would like to make a presentation at one of our Chapter luncheons, please contact us.