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Description Return to Event
Session Details

PDC D1: Choosing Solders for the New Era: Low Cost High Reliability Solder Alloys (8-10am)
(Event: IMAPS 2017 - 50th International Symposium on Microelectronics)

Oct 09, 2017 8:00am - Oct 09, 2017 10:00am
Session Type: PDC

Description

Track D:
Reliability

D1: Choosing Solders for the New Era: Low Cost High Reliability Solder Alloys
Instructor: Ning-Cheng Lee, Indium Corporation

 

Course description:

While the electronic industry is advancing rapidly toward miniaturization, two more important drivers actually dictate whether the manufacturers could stay in the game or not -  Low Cost, and High Reliability. The former is the ticket to get into the game, while the latter is the ticket to stay in the game. These two drivers exemplified their vital role most astonishingly in solder materials. This course covers the roles of solder composition on cost, and on reliability. After reviewing the role of Ag in both cost and reliability, the solder materials are reviewed from the lowest cost, zero-Ag solders to composition with higher and higher Ag content. Among all of the alloy options present on the market, including the most recent development, the representative alloys are introduced with more details, including materials properties, soldering performance, some of the known failure modes, and the primary merit of these alloys.

 

Who Should Attend?

Technology directors, technology managers, product managers, design engineers, process engineers, reliability engineers, material scientists, process technicians, anyone who wants to know what are the solder alloys available, and what are the pros and cons about all of the options on solder alloys should take this course.

 

Biography:

Ning-Cheng Lee is Vice President of Technology of Indium Corporation. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 30 years of experience in the development of fluxes and solder pastes for SMT industries. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973. He is author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies”, and co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials”. He was honored as 2002 Member of Distinction from SMTA, 2003 Lead Free Co-Operation Award from Soldertec, 2006 Exceptional Technical Achievement Award and 2007 Distinguished Lecturer from CPMT, 2009 Distinguished Author from SMTA, 2010 Electronics Manufacturing Technology Award from CPMT, 2015 IEEE Senior Member, 2015 Founder’s Award from SMTA, and 2017 IEEE Fellow.   

 

  

Session Fees
Fee TypeMember FeeNon-Member Fee
This session is free
Early: $300.00 $300.00
Regular: $400.00 $400.00
Late: $400.00 $400.00

 
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