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Description Return to Event
Session Details

PDC B3: Introduction to Fan Out Packaging (1-3pm)
(Event: IMAPS 2017 - 50th International Symposium on Microelectronics)

Oct 09, 2017 1:00pm - Oct 09, 2017 3:00pm
Session Type: PDC

Description

Track B:
Next Generation Packaging Challenges

B3: Introduction to Fan Out Packaging
Instructor: John Hunt, ASE US, Inc.

 

Course description:

With the fierce competition between mobile device manufacturers, along with the rise of the Internet of Things, the Electronics industry has been driven by the need for a continual reduction in the thickness and volume of semiconductor packaging.  Fan Out technology has evolved as an alternative package to answer this need for miniaturization of electronics.

 

We will review how the integration of wafer level processing technologies, substrate evolution and Flip Chip packaging structures have come together into what is being called Fan Out Packaging.  These packages are for both low density and high density, Mobile and server applications. They have higher levels of integration and sophistication than has ever been possible in the past.  A basic overview of the concept of Fan Out packaging, a history of its evolution, and market trends will be included in this course.

 

Biography:

John Hunt is Senior Director for Engineering, Technical Promotion, at ASE (US) Inc., and provides technical support for the Introduction, Engineering, Marketing, and Business Development activities for Advanced Wafer Level and Fan out Packaging Technologies at ASE.

 

John has more than 45 years of experience in various areas of manufacturing, assembly and testing of electronic components and systems, with emphasis on the development of new technologies and processes, with a B.S. from Rutgers and an M.S. from University of Central Florida. 

 

  

Session Fees
Fee TypeMember FeeNon-Member Fee
This session is free
Early: $300.00 $300.00
Regular: $400.00 $400.00
Late: $400.00 $400.00

 
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