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Description Return to Event
Session Details

PDC A3: Fundamentals of 3D and 2.5D Packaging Integration (*NEW TIME: 1pm-3pm*)
(Event: IMAPS 2017 - 50th International Symposium on Microelectronics)

Oct 09, 2017 1:00pm - Oct 09, 2017 3:00pm
Session Type: PDC

Description

Track A:
Intro to Microelectronics Packaging

A2: Fundamentals of 3D and 2.5D Packaging Integration
Instructor: Urmi Ray, STATS ChipPAC

(*NEW TIME: 1pm-3pm*)

 

Course description:

This course will cover the fundamental technology aspects of 3D and 2.5D integration including summaries of key benefits, process flow, test, cost and reliability challenges. The goal of this course is to provide a review of technology status to date and spend additional time on case studies of market and product adoption.

 

Course outline:

• Why 3D:

o New architectural & partitioning capabilities

o Package Density and Form Factor

o Improved Performance

• Types of 3D:

o Via first

o Via middle

o Via last

• Types of 2.5D

o Si/glass interposer

o Fan Out

o Laminate substrate/embedding

• Manufacturing process flow for Via-middle

• Manufacturing process flow for Si interposer

• Challenges for market adoption

o Cost

o Reliability

o Supply Chain

o Others

• Case Studies of successful recent product adoption

o HBM memory with TSV

o Graphics processor integration using 2.5D

• Roadmap

 

Biography:

Urmi Ray is currently Senior Director at STATS ChipPAC. Prior to joining STATS, Urmi served as  a Principal Engineer in Qualcomm where she had been the technology and program lead in several forward looking programs in 3D and 2.5D and system integration, with particular focus on low cost packaging for mobile industry. She joined Qualcomm in 2006, after spending 10+ years at Lucent Technologies Bell Laboratories in NJ working on advanced materials and reliability for a diverse set of product portfolios, including consumer products to high reliability telecommunications projects. She is currently active in many aspects of advanced packaging technology area. She has a PhD from Columbia University (New York City). 

 

  

Session Fees
Fee TypeMember FeeNon-Member Fee
This session is free
Early: $300.00 $300.00
Regular: $400.00 $400.00
Late: $400.00 $400.00

 
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