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Description Return to Event
Session Details

Industry Tour (Monday, Oct 9, 9a-5p)
(Event: IMAPS 2017 - 50th International Symposium on Microelectronics)

Oct 09, 2017 7:30am - Oct 09, 2017 4:00pm
Session Type: Technical


Micross is the leading one-source, one-solution provider of bare die & wafers, wafer bumping & advanced interconnect technologies, custom packaging & assembly, component modification services, electrical & environmental testing and Hi-Rel products to manufacturers and users of semiconductor devices.  In business for 35+ years, our comprehensive array of high-reliability capabilities serves the global defense, space, medical, industrial and fabless semiconductor markets. Micross possesses the sourcing, packaging, assembly, test and logistics expertise needed to support an application throughout its entire program cycle.


Micross Advanced Interconnect Technology (AIT), a specialized division of Micross, is home to one of the premier wafer bumping and wafer level packaging facilities in the U.S., with 20+ years of experience developing and providing leading edge interconnect and 3D integration technologies (TSV, Si interposers, 3D IC) to customers around the world.  AIT has the unique ability to support early stage development needs as well as low-to-mid volume production for more mature applications and platform technologies.  Our ITAR-registered facility supports wafer sizes up to 200mm with established and proven processes and the flexibility to tailor unique solutions for your most demanding interconnect requirements. The facility can also support the processing of non-standard materials, as well as the fabrication of novel device structures (e.g. MEMS and 3D microstructures).


Arrival at Micross and sign-in  11:10 -11:25

Introduction/Welcome to AIT (20-30 min) 11:30-12

Lunch 12-1  (IMAPS will bring in catered lunch for group)

Tour 1 (10-12 people): 11:55 ~12:40

Tour 2 (10-12 people): 12:00~12:45

Tour 3 (10-12 people): 12:05~12:50

Coffee in lobby 12:30-1:00

Depart 1:00


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