Members Only
Events Calendar
Online Store
Global Business Council
Industry News
IMAPS Foundation
Contact Us
My Professional Dev
Donate Funds
Description Registration Return to Event
Session Details

PDC B2: Introduction to Package-on-Package (PoP) Design, Assembly and Quality: Focus on New Trends
(Event: IMAPS 2017 - 50th International Symposium on Microelectronics)

Oct 09, 2017 10:30am - Oct 09, 2017 12:30pm
Session Type: PDC


Track B:
Next Generation Packaging Challenges

B2: Introduction to Package-on-Package (PoP) Design, Assembly and Quality: Focus on New Trends and Applications for Advanced Packaging
Instructor: Fernando Roa, Amkor Technology, Inc


Course description:

This course will provide an introduction to design, packaging and reliability fundamentals required in the definition, process development and production of package on package applications. As such, we'll delve into critical design rules to observe during the layout of the substrates required for such packaging as well as best known methods for assembly including rules of thumb for selection of materials. The course will also include typical process flows used based on final EMS implementation of these PoPs and quality metrics to use.


Who Should Attend?

Design, product and process engineers, managers, procurement organizations from OEM and IDM organizations operating the baseband, AP and advanced packaging of components; also, CM and EMS representatives which are receiving PoPs for integration on boards.



Fernando Roa, PhD, Sr Director, Advanced Products, Amkor Technology, Inc. Fernando has been with Amkor since 2007, working in product management, technology development and strategic initiatives roles. In his current position, he’s responsible for Copper pillar flip chip packaging platform development and commercialization in addition to other advanced packaging initiatives. Fernando received his PhD in Chemical Engineering from University of Colorado in 2003. After completing his PhD, Fernando joined Intel Corporation where he worked in assembly process development and Platform Integration. 

Fernando holds 10 US Patents and has published over 25 papers in different publications. 



© Copyright 2005-2007

Copyright Abila Inc 2018