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Description Return to Event
Session Details

PDC A1: Introduction to System in Package (SiP) – The Heterogeneous Integration Driver (8-10am)
(Event: IMAPS 2017 - 50th International Symposium on Microelectronics)

Oct 09, 2017 8:00am - Oct 09, 2017 10:00am
Session Type: PDC

Description

Track A:
Intro to Microelectronics Packaging

A1: Introduction to System in Package (SiP) – The Heterogeneous Integration Driver
Instructor: Mark Gerber, ASE US, Inc.

 

Course description:

This PDC course will introduce the package platform SiP (System-in-Package) and how some companies are diversifying from SOC (System-on-a-Chip) to leverage heterogeneous silicon integration and overall package miniaturization.  A short market perspective will be reviewed as well as how industry segments are leveraging SiP and how the OEM market is evolving and creating system level ecosystems to enabling content revenue- a key area of IOT.  SiP general process flow details will be covered as well as key process considerations for yield improvements.  In addition, a brief overview of some of the tools that may be leveraged to help miniaturize module solutions and improve performance.   As SiP has evolved, there has also been interest in Fan Out Wafer level technology and the potential integration of multiple active devices as well as discretes into this technology- a brief overview of this option and considerations will be discussed.

 

Biography:

Mark Gerber is the Director of Engineering & Technical Marketing at ASE-US Inc, specializing in Flip Chip and Advanced Interconnect package technologies. Mark joined ASE in Feb of 2015, and brings a diverse set of semiconductor experiences from Texas Instruments, Motorola/Freescale, and Dallas Semiconductor, including advanced interconnect & IC package development, as well as a history of new product introductions. Mark holds a bachelor’s degree in Mechanical Engineering from Texas A&M University, and has worked in the Semiconductor Industry for the last 20 years, has written +20 papers, and currently holds over 30 patents in the area of semiconductor packaging. 

 

  

Session Fees
Fee TypeMember FeeNon-Member Fee
This session is free
Early: $300.00 $300.00
Regular: $400.00 $400.00
Late: $400.00 $400.00

 
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