D3: Package/Board Level Integrity & Solder Joint Reliability
Instructor: Jennie Hwang, H-Technologies Group
With the goal to produce reliable products while achieving high yield production, this course provides a holistic overview of product reliability and of critical â€œplayersâ€of the package/board level integrity and solder joint reliability, including the roles of materials, processes and testing/service conditions, as well as the crucial principles behind the product reliability. Recent developments related to lead-free package and board assembly, lead-free solder materials, PCB laminates and surface finishes in relation to manufacturability and reliability will be outlined.
The likely solder joint failure modes (interfacial, near-interfacial, bulk, inter-phase, intra-phase, voids-induced, surface-crack and others) will be illustrated. Solder joint reliability fundamentals including fatigue and creep damage mechanisms via ductile, brittle, ductile-brittle fracture will be outlined. To withstand harsh environments, the strengthening metallurgy to further increase fatigue resistance and creep resistance and the power of metallurgy and its ability to anticipate the relative performance will be illustrated by examining the comparative performance in relation to metallurgical phases and microstructures.
Parameters for a working life-prediction model will be highlighted. A relative reliability ranking among commercially viable solder systems, the scientific, engineering and manufacturing reasons behind the ranking, and newer solder alloy developments and their impact on product performance and reliability will be summarized.
The course also examines the role of intermetallics at-interface and in-bulk (contributing from packages and board surface finish coating) in relation to product reliability. The difference between SnPb and Pb-free solder joint in terms of intermetallic compounds, which in turn is attributed to production-floor phenomena and the actual field failure, will be discussed. From practical perspectives, tin whisker with emphasis on risk mitigation through understanding the factors that affect tin whisker growth and its preventive and remedial solutions will be outlined. Practical tin whisker criteria for reliability implications in the lead-free environment and the relative effectiveness and the order of priority in mitigating measures will be ranked.
The course emphasizes on practical, working knowledge, yet balanced and substantiated by science. Attendees are encouraged to bring their own selected systems for deliberation.
Who Should Attend?
The course provides a higher level of working knowledge in package/board level integrity and solder joint reliability to all who are concerned about or interested in understanding product integrity and solder joint reliability, including designers, researchers, managers, quality, manufacturing and reliability professionals; also designed for those who desire the scientific basis behind the practical know-how.
Dr. Hwang, a long-standing leader in lead-free implementation and SMT manufacturing , brings deep knowledge to this course through both hands-on and advisory experiences. She has provided solutions to many challenging problems, ranging from production yield to field failure diagnosis to reliability issues in both commercial and military applications. She has 475+ publications to her credit, including the sole authorship of several internationally-used textbooks, and is a speaker in innumerable international and national events. Her formal education includes Harvard Business School Executive Program and four academic degrees (Ph.D. M.S., M.S., B.S.) in Metallurgical Engineering and Materials Science, Physical Chemistry, Organic Chemistry and liquid Crystal Science. She has held various senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and IEM Corp. She is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees.