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2018 Florida Chapter Technical Workshop and Symposium - Design for DoD

Feb 21, 2018 1:00pm -
Feb 21, 2018 7:30pm

Event Type: Chapter
Category: Chapter Meeting

Speaker Information


Two parallel sessions from 1:00 PM to 4:30 PM; Keynote Presentation 5:00 to 5:30PM

EXHIBITS from 3:00PM - 7:30PM with hors d'oeuvres served in the Exhibits area - Cash Bar.


  Packaging Technology Expectations for Next Generation Military Communications Systems - Michael P. O’Reilly, V.P. of Engineering at GCSD of Harris Corporation


Michael P. O’Reilly is vice presi­dent of Engineering and Advanced Systems and Technology (AS&T) for the Defense Programs business unit within Government Com­munications Systems Division. The Defense Programs business pro­vides communications systems, networks, and products for military aerospace, terrestrial, and maritime applications.

Mr. O’Reilly is responsible for tech­nical management and execution within the Defense Programs busi­ness unit which services domestic and international defense mar­kets. He oversees an engineering department of 200 professionals in Melbourne, Florida, and Long Beach, California. In addition to his engineering leadership duties, Mr. O’Reilly oversees the AS&T organi­zation, chartered with identifying and incubating strategic technolo­gies with the goal of long term business growth.

Defense Programs is a $500 mil­lion world-class provider of assured communications® systems and infor­mation technology solutions. Its customers include the U.S. Army, Navy, Air Force, and Marine Corps, foreign defense organizations, and other major defense contractors.

Mr. O’Reilly holds bachelors and master’s engineering degrees from the University of California where he also performed postgraduate management coursework. Holder of three Harris Engineering awards and five patents, Mr. O’Reilly has also received numerous leadership awards since joining Harris.



Teacher Advisors: Mrs. Rebecca Kimbrell and Mrs. Carrie Robertson

The students attending the IMAPS conference are a combination of Technology Student Association (TSA) and Robotic Clubs.



AMERI at Florida International University- is an open access research facility to support academic and industrial prototyping requirements in electronic packaging (both deposited and ceramic), MEMS and NEMS fabrication and materials characterization and analysis.




Session 1: Interconnect Reliability

Session 2: High Density / 3D Packaging

1:00 – 1:25

Silver Epoxy Filled Via Analysis for High Reliability RF MCM Microelectronics

Joe Kreuzpaintner, Harris Corporation

Development of Biocompatible Implantable Package with Very High Density for Neurostimulator Applications

Ali Karbasi, Florida International University

1:25 – 1:50

Continuous Au-Sn-Ni-Cu-Pb (ASN-CP) Layer Formation on Double Tin and Wicked Thick-Au/Ni Plated Printed Circuit Boards

Jeffrey Jennings, Harris Corporation

Device Level 3D Integration Technologies for High Performance System in Package Modules 

Daniel Baldwin, Engent, Inc.

1:50 – 2:15

Issues with Pb-Free Soldering & Solution Options

Werner Engelmaier, Engelmaier Associates

Development of Novel 3-D Cube Antennas for Compact Wireless Sensor Nodes 

Thomas Weller, University of South Florida

2:15 – 2:40

High Current Handling and High Reliability Solder ACFs FOB (Flex On Board) Joints using an Ultrasonic Bonding Method 

Kyung W. Paik, KAIST

A Printed-Electronics Flying Camera


Paul Deffenbaugh, nScrypt

2:40 – 2:50



Session 3: Microelectronic Assembly / Packaging

Session 4: Advanced Technology & Emerging Industry Issues

2:50 – 3:15

Conditions for Optimized Deep Access - Gold Ball Bonding Performance

Larry Crider, Harris Corporation

IMAPS National Technical workshop initiatives and Educational Outreach

Mike Newton, IMAPS NEC - VP Technical Programs

3:15 – 3:40

Measuring and Controlling Volatiles in Hermetically Sealed Enclosures


Bob Lowry, Electronic Materials Characterization

Global Technology Survey of Anisotropic Conductive Interconnect Technologies, Past Present and Future - An Industry Intellectual Property Approach

Edmar Amaya, EDAM LAW PLLC

3:40 – 4:05

MEMS Device Sealing in a High Vacuum Atmosphere - Achieving Long Term Reliable Vacuum Levels

Bruce Wilson, STT International

Implementation of Magneto-Dielectric Polymer Nanocomposites for RF/MW Antenna Applications 

Jing Wang, University of South Florida

4:05 – 4:30

The Growth of Copper Wire Bonding

Lee Levine – Process Solutions Consulting Inc

Identifying and Avoiding Counterfeit Electronic Components


Bob Lowry, Electronic Materials Characterization



5:00 – 5:30

Keynote:  Packaging Technology Expectations for Next Generation Military Communications Systems



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