Home
Members Only
About IMAPS
Membership
Events Calendar
Online Store
Chapters/Committees
Global Business Council
Industry News
Publications
Careers
IMAPS Foundation
Contact Us
Login
My Professional Dev
Articles
Donate Funds

Shopping

Guest
Merchandise Details
Webinar Download - Rheology Issues in Electronic Packaging (2010)
Member Price$250.00
Non-Member Price$500.00
Merchandise Description

WEBINAR DOWNLOAD

IMAPS PDC Webinar Series on
Rheology Issues in Electronic Packaging

This three-session on-line Professional Development Course (PDC) webinar was held:
Tuesdays, November 16, 23 and 30, 2010

Key Words

Rheology, polymers, thermosets, thermosetting polymers, adhesives, coatings, mold compounds, die attach, rheology during curing, chemorheology of epoxy curing, epoxies, dielectric cure monitoring

Program Description

This on-line PDC was held as a series of 3 one-hour lectures.  Below is a course outline for each session.  Each session was scheduled 50 minutes of lecture followed by 10 minutes of Q&A. The download for this webinar includes all three sessions with their related Q/A sessions.

Introduction to Rheology
This session will provide a broad overview of the basic concepts of rheological properties and types of instrumentation for rheological measurements.

Rheology in Semiconductor Packaging
This session will build on the previous webinar and cover some key rheological considerations governing the performance of polymer-based materials used in packaging semiconductors. In most cases, adhesives, underfills, mold compounds and coatings are applied as viscous liquids and then cured. The flow properties are critical to performance in high volume manufacturing.

Rheological Considerations in Substrate and Printed Circuit Board Fabrication
Semiconductor substrates and printed circuit boards are complex composites typically manufactured using a lamination process. Cores with circuit features are laminated with prepregs (B-staged, partially cured glass cloth composites) to form multilayer structures. The lamination process involves both chemical and viscoelastic property changes during lamination.

Presenter

Dr. Jeff Gotro has over twenty-six years experience in polymers for electronic applications and composites having held scientific and leadership positions at IBM, AlliedSignal, Honeywell, and Ablestik Laboratories. He is an accomplished technology professional with demonstrated success directing new product development, leading to multi-million dollar revenues. He has global experience developing new products having established a full function R&D and Applications Engineering lab in Shanghai, China for Ablestik Laboratories. Jeff has consulting experience with companies ranging from early-stage start-ups to Fortune 50 companies.

Jeff is a nationally recognized authority in thermosetting polymers and he has received invitations to speak at prestigious Gordon Research Conferences (Thermosetting Polymers and Composites). He has presented numerous lectures and short courses at national technical conferences.   Jeff was an Adjunct Professor at Syracuse University in the Dept. of Chemical Engineering and Materials Science from 1986-1993.  He taught Six Sigma Black Belt and Green Belt at California State University at Fullerton from 2001-2006, and teaches courses on Innovation and Product Development in the MBA program at Concordia University in Irvine, CA. 

Jeff is a member of the Product Development and Management Association (PDMA), American Chemical Society (ACS), the Institute for Management Consultants (IMC), the Forensic Expert Witness Association (FEWA), and the International Microelectronics and Packaging Society (IMAPS).

Jeff has published 60 technical papers (including 4 book chapters) in the field of polymeric materials for advanced electronic packaging applications, holds 13 issued US patents, and has 7 patents pending. 

Jeff has a Ph.D. in Materials Science from Northwestern University with a specialty in polymer science and a B.S. in Mechanical Engineering/Materials Science from Marquette University.

 
© Copyright 2005-2007

Copyright Abila Inc 2018