IMAPS PDC Webinar Series on
Introduction to Microelectronics Packaging Technology
This three-session on-line Professional Development Course (PDC) webinar was held:
Wednesdays, February 3, 10, and 17, 2010
Introduction microelectronics packaging technology, BEOL, photolithography, MEMS, RFID, backgrinding, wafer sawing, die attach, wire bond, hermetic sealing, solder wave packages, BGA, flip chip, 3D packaging, 3D-IC TSV, SoC, SiP, SOP, SMT, green microelectronics
This on-line PDC was held as a series of 3 one-hour lectures. Below is a course outline for each session. Each session was scheduled 50 minutes of lecture followed by 10 minutes of Q&A. The download for this webinar includes all three sessions with their related Q/A sessions.
This updated on-line PDC provides an introduction to microelectronics packaging technology to entry-level engineers and technicians involved in manufacturing, processing, R&D, quality, sales and marketing. No prior knowledge of microelectronics is required. Emphasis will be on a variety of photos and figures to provide the student with not only a solid base in how various microcircuits are made by many materials, processes and equipment, but also what they physically look like. Students will learn basic microelectronic packaging definitions as well as current state of the art terminology of materials, processes and equipment, including various relevant technologies in microelectronics and semiconductor processing.
New developments will be discussed as applied to MEMS, SiP, RFID, Thin Chips/3D/WLP, Thru-Silicon Vias, and Green Technology. An overview of major industry leaders and their new technologies will include Intel's 32nm process, IBM's C4NP, Freescale's RCP, Samsung's TSV, Amkor's SiP & SoP, and others.
Phillip Creter has over 30 years of microelectronics packaging experience and is a Life member of IMAPS. He was elected a Fellow of the Society, National Treasurer and President of the New England Chapter (twice). He received a BS in Chemistry with honors from Suffolk University and has published numerous papers, holds a U.S. patent, has made many technical presentations (received Best Paper of Session award IMAPS) and chaired numerous technical sessions for symposia. He is currently a consultant (Creter & Associates) gaining his microelectronics packaging experience at Polymer Flip Chip Corporation, Mini-Systems, GTE and Itek Corporation. His past positions include GTE Microelectronics Center Manager (receiving coveted corporate Lesley Warner Technical Achievement Award), Process Engineering Manager, Process Development Manager, Materials Engineering Manager and Manufacturing Engineer. Phil currently teaches professional development courses at microelectronics events and is an active certified instructor for the Department of Homeland Security.