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Merchandise Details
Webinar Download - Wire Bonding 2011
Member Price$250.00
Non-Member Price$500.00
Merchandise Description


IMAPS PDC Webinar Series on
Wire Bonding

This three-session on-line Professional Development Course (PDC) webinar was held:
February 8, 10 and 15, 2011

Key Words

Wire bond, intermetallic, ultrasonic welding, semiconductor packaging, BGA, 3D packaging, SOP

Program Description

This on-line PDC was held as a series of 3 one-hour lectures.  Below is a course outline for each session.  Each session was scheduled 50 minutes of lecture followed by 10 minutes of Q&A. The download for this webinar includes all three sessions with their related Q/A sessions.

In Session 1 we focused on:

  • The Ball Bond Process: Step by Step Wire Bonding
  • Welding
  • The effect of ultrasonics on weld formation and materials properties
  • Metallurgy and Intermetallics
  • A comparison of the welds associated with Au-Al and Al-Cu bonding
  • Au-Al failure mechanisms in ultra-fine pitch bonding
  • The effect of wire alloying on ultra-fine pitch reliability

In Session 2 we focused on:

  • Wire properties, testing and chemistry
  • Pull and shear testing wire bonds
  • Long term accelerated testing of wire bonds
  • Understanding wire stiffness and the effect on looping
  • Wire bond loop shapes

In Session 3 we focused on:

  • The second bond
  • Diffusion
  • The principal bonding variables
  • Capillary design and selection for optimized processes
  • Simple bond screening designed experiments
  • How to optimize the bonding process


Lee is a consultant for Process Solutions Consulting, Inc. where he provides process engineering consultation and SEM/EDS analysis. Lee’s previous experience includes 20 years as Principal and Staff Metallurgical Process Engineer at Kulicke & Soffa and Distinguished Member of the Technical Staff at Agere Systems. He has been awarded 4 patents, published more than 50 technical papers, and in 1999 won the John A. Wagnon Technical Achievement award from the International Microelectronics and Packaging Society (IMAPs). Major innovations include copper ball bonding, loop shapes for thin, small outline packages (TSOP and TSSOP, and CSPs) and introduction of DOE and statistical techniques for understanding semiconductor assembly processes. He is an IMAPs Fellow, V.P of the Keystone Chapter, and he is a senior member of IEEE.

Lee is a graduate of Lehigh University, Bethlehem, Pa where he earned a degree in Metallurgy and Materials Engineering.

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