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Merchandise Details
Webinar Download - Component Chip Attach
Member Price$200.00
Non-Member Price$375.00
Merchandise Description


IMAPS PDC Webinar Series on
Guide to Component Chip Attach – Including Flip Chip

This two-session on-line Professional Development Course (PDC) webinar was held:
Tuesdays, September 14, and 21, 2010

Key Words

Chip attach, die attach, direct chip attach, flip chip, bonders, polymer adhesives, epoxy bonding, silver glass, die eutectics, sintered nanosilver, dispensing, curing, SMT SMEMA, UBM, ICA, ACA, underfill, stud bumping, wafer bumping, lot travelers, cleanroom, 883 Test Methods

Program Description

This on-line PDC was held as a series of 2 one-hour lectures.  Below is a course outline for each session.  Each session was scheduled 50 minutes of lecture followed by 10 minutes of Q&A. The download for this webinar includes both sessions with their related Q/A sessions.

This course provides an industry-proven training guide to successful hands-on component chip attach including flip chip for use by engineers and senior technicians in a prototype or manufacturing environment. It uses simple terms for ease of understanding yet includes aspects of advanced packaging for more experienced engineers needing an update in technology. It is also of value for people in quality assurance, sales, marketing, purchasing, safety, administration, and program management.

After a brief review of the overall assembly process, details will be presented on traditional component chip attachment of passives (capacitors, inductors, resistors), actives/die (diodes, transistors, ICs), and rework methods. Current fundamental chip attach materials will be examined: polymer (epoxy), silver glass frit, eutectic (hard solder), solder and polymer SMT, and an update on sintered nanosilver material. Special attention will be given to Flip Chip and Flip Chip packaging applications. Participants will learn definitions of all related terminology (WLP, C4, UBM, ICA, ACA, UF & stud bumping), techniques, processes, materials, substrates and equipment used in flip chip die attachment and underfill using both solder and polymers. Included: types of wafer bumping, pick and place, solder reflow, polymer cure, and underfilling. Topics include: SMT solder reflow, pick and place, dispensing, stamping, stencil printing, epoxy vs. eutectic, rework, and process control methodology. Examples of actual process procedures and industry lot travelers are included.

Reliability testing and screening methods as well as analysis techniques for various types of component attach are discussed using optical, die shear, scanning electron microscopy and scanning acoustic microscopy. Operator issues include: setup, proper documentation, use of industry-proven lot travelers, inspection criteria, rework techniques and safety.


Phillip Creter has over 30 years of microelectronics packaging experience and is a Life member of IMAPS. He was elected a Fellow of the Society, National Treasurer and President of the New England Chapter (twice). He received a BS in Chemistry with honors from Suffolk University and has published numerous papers, holds a U.S. patent, has made many technical presentations (received Best Paper of Session award IMAPS) and chaired numerous technical sessions for symposia. He is currently a consultant (Creter & Associates) gaining his microelectronics packaging experience at Polymer Flip Chip Corporation, Mini-Systems, GTE and Itek Corporation. His past positions include GTE Microelectronics Center Manager (receiving coveted corporate Lesley Warner Technical Achievement Award), Process Engineering Manager, Process Development Manager, Materials Engineering Manager and Manufacturing Engineer. Phil currently teaches professional development courses at microelectronics events and is an active certified instructor for the Department of Homeland Security.

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